PCB manufacturers are increasingly focusing on designing smaller printed circuit boards.  We integrate fewer through hole components while incorporating more surface mount technology (SMT). For large plated through holes, we Allocate less space on the board. Instead of plated through holes, we are increasingly using SMT components. All our PCBs are designed to use vias.
Through holes are plated through holes found in PCBs to trace traces from the surface layers of the board to internal and other layers. PCB vias can be plated to make electrical connections, and they can be drilled mechanically.
Although vias are essential in multi-layer PCB boards, designing and producing them is challenging. They create thermal and electrical currents between different layers of the board Paths. Essentially, vias are channels of different types and sizes.

PCB Via Type

There are 5 types of PCB vias. They are;
1. Blind Via - A blind via is a type of laser that only transmits from one layer to the next.
1. br style="box-sizing: border-box;"/>2. Buried via – This type of via is between internal layers and is required when there is a sequential or multi-layer laminate project.
3. Vias – Vias connect two outer layers by drilling from top to bottom.

Common uses of vias PCB design

• Signal Routing – A large number of PCB boards use through-holes for signal routing. However, thicker boards use buried or blind vias, while light boards use only micro-vias.
• Power Routing – Vias in most PCBs are limited using wide through-hole vias for power and ground net routing, although blind vias can also be used.
• Escape routing - Larger surface mount components (SMTs) primarily use through-hole vias for escape routing. Micro or blind vias are most commonly used for escape routing, but vias in pads can be used for solid packaging, Such as high pin count BGA.
• Splicing – through or blind vias can be used to provide multiple connections to planes. For example, a strip of metal with stitched vias Tape around sensitive areas of the circuit, connecting it to a ground plane to provide EMI protection.
• Thermal Conduction – Vias can be used for routing from internal plane layers through which components are connected Thermal conduction. Typically, thermal vias require dense blind vias or vias that must be located in the pads of these devices.

4. Microvias - Microvias are laser drilled instead of mechanically drilled, allowing less than 0.006 inches.
5. Via-in-pad – This via is located in the pad of the surface mount component.